Aside from the totally fair objection of "wtf are you doing?" is there anything that would technically prevent me from doing this, such as a diode between core_vdd and io_vdd?
I was reading the PDK documentation for our IO cells a few days ago, and they mention we don't have circuit under the pad on the IO cells in order to comply with the restrictions of the 3 metal layer process (gf180mcuA).
So since we are targeting mcuD does this mean there is an opportunity to shorten the io pads by as much as 75um if they where reworked ?
The bond pad is non-CUP due to design manual restriction on 3LM.
Given the trouble with bonding I'm not sure I would go to CUP ...
Tim Edwards
See https://github.com/fossi-foundation/frigate_analog. Basically a field-programmable analog array with DACs, ADCs, instrumentation amplifiers, temperature sensor, etc., etc. Hard to port from sky130 to another process, but I would like to do that for GF180MCU and IHP sg13g2 eventually.
You don't happen to have the skills it takes to figure decently efficient hyperparameters for letting Xyce simulate up to a couple mm^2 of gf180mcuD PEX extraction, or do you?
I lack the background to know how to tune the bunch of solver options and solver choices offered
I'm just seeing it being highly stalling on memory with also sadly substantial lacks in reasonable prefetching behavior (it's nowhere near 30% bandwidth utilization and hovers around 0.02~0.05 IPC... Yeah it's bad.)
Great.
Let's chat later starting in like 2 hours from now, or up to a couple hours later than that?
Essen
I was reading the PDK documentation for our IO cells a few days ago, and they mention we don't have circuit under the pad on the IO cells in order to comply with the restrictions of the 3 metal layer process (gf180mcuA).
So since we are targeting mcuD does this mean there is an opportunity to shorten the io pads by as much as 75um if they where reworked ?
The bond pad is non-CUP due to design manual restriction on 3LM.
Hello #NakedDieFriday fans, hope you did not miss me too much. Here is this week's eye candy for you.
Supplied by good folks at wafer.space/ was a batch of die samples from their first production run. Here is one of them -- a die-sized doodle of their logo. It is open source too: github.com/89Mods/ws-logo-die
There is circuitry there apart from the logo, but the project readme does not say what it does. :-)
Full-res map: infosecdj.net/map/wafer-space/…
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Archit3ch
I'm travelling without a laptop. Currently on the metro. I can share a 1000-foot plan.
Yes, it seems that the package prepared by Tim didn't include any of the TTP2/TTPG dies. If you still have any left over, maybe you could get those to Dmitry?
Leo Moser (mole99)
Yes, it seems that the package prepared by Tim didn't include any of the TTP2/TTPG dies. If you still have any left over, maybe you could get those to Dmitry?
I’m fairly certain pinout won’t change for 1x1. Finer details like number of layers and position of vias might.
Pinout for 1x0p5 might change slightly as the ordering of 4 pins is reversed compared to the die which is likely a recipe for confusion in future
I don’t think 0p5x1 would change, but the run 1 ones aren’t tested yet.
For quarter slot there was talk of using a different connector (fewer pins = cheaper)
Leo Moser (mole99)
Yes, it seems that the package prepared by Tim didn't include any of the TTP2/TTPG dies. If you still have any left over, maybe you could get those to Dmitry?
I could give it a try, though the resolution/magnification will be very low due to the area that needs to be covered. One 1x1 die takes about ~16h to image
@InfoSecDJ - I think we worked out that my automated microscope (a Labsmore thing from @digshadow) at PS1 would take roughly like 17 hours to do a mask, which is like one a day.
@InfoSecDJ - I think we worked out that my automated microscope (a Labsmore thing from @digshadow) at PS1 would take roughly like 17 hours to do a mask, which is like one a day.
Hmmmm at 100nm pixel size if running 20 fps (as a Pi5 could, at least with an LED strobe) and 50% overlap in both directions (so each spot gets nominally 4 captures coverage) it's "just" 34 seconds plus no-capture times caused by whatever acceleration limits the motion stage imposes at the ends of the zig-zag scan.
good news, I am through all the samples @Leo Moser (mole99) sent me. browsable images here:
http://infosecdj.net/map/#wafer-space
if you need single images and/or previews, ping me for download urls.